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At-speed testing of inter-die connections of 3D-SICs in the presence of shore logic
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At-speed testing of inter-die connections of 3D-SICs in the presence of shore logic
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Date
2015-11
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Shibin, Konstantin
;
Chickermane, Vivek
;
Keller, Brion
;
Papameletis, Christos
;
Marinissen, Erik Jan
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1914
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations
Metrics
Views
1914
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations