Publication:

Etch challenges on single and dual SOI fins patterning for CFET at 25nm fin pitch

Date

2019
Presentation
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dc.contributor.authorChan, BT
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorRyckaert, Julien
dc.contributor.authorZhang, Liping
dc.contributor.authorTao, Zheng
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.date.accessioned2021-10-27T07:57:22Z
dc.date.available2021-10-27T07:57:22Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32683
dc.source.conference45th Micro and Nano Engineering (MNE) Conference
dc.source.conferencedate23/09/2019
dc.source.conferencelocationRhodes Greece
dc.title

Etch challenges on single and dual SOI fins patterning for CFET at 25nm fin pitch

dc.typeOral presentation
dspace.entity.typePublication
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