Publication:

Continued scalability of copper/low-k interconnects

Date

2005
Presentation
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dc.contributor.authorBrongersma, Sywert
dc.contributor.authorCarbonell, Laure
dc.contributor.authorVanstreels, Kris
dc.contributor.authorIacopi, Francesca
dc.contributor.authorD'Haen, Jan
dc.contributor.authorZhang, Wenqi
dc.contributor.authorTravaly, Youssef
dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-10-16T00:51:10Z
dc.date.available2021-10-16T00:51:10Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10162
dc.source.conferenceMRS Spring Symposium B: Materials, Technology, and Reliability of Advanced Interconnects
dc.source.conferencedate28/03/2005
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Continued scalability of copper/low-k interconnects

dc.typeOral presentation
dspace.entity.typePublication
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