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Probing 25μm-diameter micro-bumps for Wide-I/O 3D SICs
Publication:
Probing 25μm-diameter micro-bumps for Wide-I/O 3D SICs
Date
2014
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Smith, Ken
;
Marinissen, Erik Jan
Journal
Chip Scale Review
Abstract
Description
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Views
1966
since deposited on 2021-10-22
Acq. date: 2025-10-28
Citations
Metrics
Views
1966
since deposited on 2021-10-22
Acq. date: 2025-10-28
Citations