Publication:
Probing 25μm-diameter micro-bumps for Wide-I/O 3D SICs
Date
| dc.contributor.author | Smith, Ken | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-22T06:00:52Z | |
| dc.date.available | 2021-10-22T06:00:52Z | |
| dc.date.issued | 2014 | |
| dc.identifier.issn | 1526-1344 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24546 | |
| dc.identifier.url | http://www.chipscalereview.com/issues/0114/index.php | |
| dc.source.beginpage | 20 | |
| dc.source.endpage | 23 | |
| dc.source.issue | 1 | |
| dc.source.journal | Chip Scale Review | |
| dc.source.volume | 18 | |
| dc.title | Probing 25μm-diameter micro-bumps for Wide-I/O 3D SICs | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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