Publication:
Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1993 since deposited on 2021-10-16
Acq. date: 2025-12-12
Citations
Metrics
Views
1993 since deposited on 2021-10-16
Acq. date: 2025-12-12
Citations