Publication:
Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip
Date
| dc.contributor.author | Rits, Olivier | |
| dc.contributor.author | Bockstaele, R. | |
| dc.contributor.author | Naessens, Kris | |
| dc.contributor.author | Baets, Roel | |
| dc.contributor.imecauthor | Rits, Olivier | |
| dc.contributor.imecauthor | Baets, Roel | |
| dc.contributor.orcidimec | Baets, Roel::0000-0003-1266-1319 | |
| dc.date.accessioned | 2021-10-16T04:31:53Z | |
| dc.date.available | 2021-10-16T04:31:53Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11106 | |
| dc.source.beginpage | 133 | |
| dc.source.conference | Proceedings 15th European Microelectronics and Packaging Conference - EPMC | |
| dc.source.conferencedate | 12/06/2005 | |
| dc.source.conferencelocation | Brugge Belgium | |
| dc.source.endpage | 138 | |
| dc.title | Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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