Publication:

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00063
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dc.contributor.authorChancerel, Francois
dc.contributor.authorUrban, Peter
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorHalas, Simon
dc.contributor.authorBravin, Julian
dc.contributor.authorBrems, Steven
dc.contributor.authorUhrmann, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChancerel, Francois
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChancerel, Francois::0000-0003-4512-1634
dc.contributor.orcidimecSlabbekoorn, John::0000-0002-6098-8618
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-10T15:05:55Z
dc.date.available2024-12-07T16:57:33Z
dc.date.available2025-04-10T15:05:55Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00063
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44942
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage343
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage347
dc.source.journalN/A
dc.source.numberofpages5
dc.title

IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

dc.typeProceedings paper
dspace.entity.typePublication
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