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Damage free cryogenic etching of porous organosilica ultralow-k film

Date

2012
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dc.contributor.authorZhang, Liping
dc.contributor.authorLiazouli, Remi
dc.contributor.authorDussart, Rami
dc.contributor.authorLefaucheux, Philippe
dc.contributor.authorTillocher, Thomas
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorMankelevich, Yuri
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-20T19:35:38Z
dc.date.available2021-10-20T19:35:38Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21919
dc.source.conferenceAVS 59th Annual International Symposium and Exhibition
dc.source.conferencedate28/10/2012
dc.source.conferencelocationTampa, FL USA
dc.title

Damage free cryogenic etching of porous organosilica ultralow-k film

dc.typeMeeting abstract
dspace.entity.typePublication
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