Publication:

Mitigation of the etch-induced intra-field overlay contribution

Date

2022
Proceedings Paper
https://doi.org/10.1117/12.2614255
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dc.contributor.authorvan Haren, Richard
dc.contributor.authorYildirim, Oktay
dc.contributor.authorMouraille, Orion
dc.contributor.authorvan Dijk, Leon
dc.contributor.authorKumar, Kaushik
dc.contributor.authorFeurprier, Yannick
dc.contributor.authorJehoul, Christiane
dc.contributor.authorHermans, Jan
dc.contributor.imecauthorJehoul, Christiane
dc.contributor.imecauthorHermans, Jan
dc.contributor.orcidimecHermans, Jan::0000-0003-1249-8902
dc.date.accessioned2023-06-06T10:27:52Z
dc.date.available2022-09-08T02:39:17Z
dc.date.available2023-02-16T11:41:14Z
dc.date.available2023-06-06T10:27:52Z
dc.date.issued2022
dc.identifier.doi10.1117/12.2614255
dc.identifier.eisbn978-1-5106-4988-0
dc.identifier.isbn978-1-5106-4987-3
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40385
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage120560D
dc.source.conferenceConference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference
dc.source.conferencedateAPR 24-MAY 27, 2020-2022
dc.source.conferencelocationSan Jose, CA
dc.source.journalProceedings of SPIE
dc.source.numberofpages12
dc.source.volume12056
dc.title

Mitigation of the etch-induced intra-field overlay contribution

dc.typeProceedings paper
dspace.entity.typePublication
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