Publication:

Structural characterization of through silicon vias (TSV)

Date

2012

Journal article

https://doi.org/10.1007/s10853-010-5144-6

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Files

21951.pdf 539.67 KB

Author(s)

;

Drijbooms, Chris

;

Van Marcke, Patricia

;

;

Philipsen, Harold

;

Journal

Journal of Materials Science

Statistics

1912 since deposited on 2021-10-20

Acq. date: 2026-02-24