Publication:

Structural characterization of through silicon vias (TSV)

Date

2012
Journal article
https://doi.org/10.1007/s10853-010-5144-6
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21951.pdf 539.67 KB

Author(s)

Bender, Hugo  
;
Drijbooms, Chris  
;
Van Marcke, Patricia  
;
Geypen, Jef  
;
Philipsen, Harold  
;
Radisic, Alex  

Journal

Journal of Materials Science

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1912 since deposited on 2021-10-20
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