Publication:

Structural characterization of through silicon vias (TSV)

Date

2012
Journal article
https://doi.org/10.1007/s10853-010-5144-6
Simple item page Full metadata Statistics
 
dc.contributor.authorBender, Hugo
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorVan Marcke, Patricia
dc.contributor.authorGeypen, Jef
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorVan Marcke, Patricia
dc.contributor.imecauthorGeypen, Jef
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.date.accessioned2021-10-20T10:05:26Z
dc.date.available2021-10-20T10:05:26Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.doi10.1007/s10853-010-5144-6
dc.identifier.issn0022-2461
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20353
dc.source.beginpage6497
dc.source.endpage6504
dc.source.issue18
dc.source.journalJournal of Materials Science
dc.source.volume47
dc.title

Structural characterization of through silicon vias (TSV)

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
21951.pdf
Size:
539.67 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles