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Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
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Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
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Date
2014-05
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Beyne, Eric
Journal
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1792
since deposited on 2021-10-22
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Acq. date: 2025-12-15
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Metrics
Views
1792
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-15
Citations