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Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
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Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
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Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Beyne, Eric
Journal
Abstract
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1821
since deposited on 2021-10-22
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last month
Acq. date: 2026-08-28
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Statistics
Views
1821
since deposited on 2021-10-22
1
last month
Acq. date: 2026-08-28
Citations