Publication:
Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling
Date
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T04:29:03Z | |
| dc.date.available | 2021-10-22T04:29:03Z | |
| dc.date.issued | 2014-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24349 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6892266&contentType=Conference+Publications | |
| dc.source.beginpage | 72 | |
| dc.source.conference | IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - 14th IEEE ITHERM | |
| dc.source.conferencedate | 27/05/2014 | |
| dc.source.conferencelocation | Lake Buena Vista, FL US | |
| dc.source.endpage | 78 | |
| dc.title | Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |