Publication:

Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials

Date

2008
Proceedings Paper
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dc.contributor.authorTravaly, Youssef
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorTruffert, Vincent
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorDupont, Tania
dc.contributor.authorCamerotto, Elisabeth
dc.contributor.authorRichard, Olivier
dc.contributor.authorBender, Hugo
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Roest, David
dc.contributor.authorVereecke, Guy
dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorBeynet, Julien
dc.contributor.authorKaneko, S.
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorMatsushita, K.
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorDupont, Tania
dc.contributor.imecauthorCamerotto, Elisabeth
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-17T11:23:22Z
dc.date.available2021-10-17T11:23:22Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14575
dc.source.beginpage52
dc.source.conference11th IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2008
dc.source.conferencelocationSan Fransisco, CA USA
dc.source.endpage54
dc.title

Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials

dc.typeProceedings paper
dspace.entity.typePublication
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