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Hybrid Metallization with Cu in sub 30nm Interconnects
Publication:
Hybrid Metallization with Cu in sub 30nm Interconnects
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Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van der Veen, Marleen
;
Soethoudt, Job
;
Delabie, Annelies
;
Varela Pedreira, Olalla
;
Vega Gonzalez, Victor
;
Lariviere, Stephane
;
Teugels, Lieve
;
Jourdan, Nicolas
;
Decoster, Stefan
;
Struyf, Herbert
;
Wilson, Chris
;
Croes, Kristof
;
Tokei, Zsolt
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2092
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Acq. date: 2025-12-16
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Metrics
Views
2092
since deposited on 2021-10-29
1
last month
Acq. date: 2025-12-16
Citations