Publication:

Hybrid Metallization with Cu in sub 30nm Interconnects

Date

2020
Proceedings Paper
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dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorSoethoudt, Job
dc.contributor.authorDelabie, Annelies
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorLariviere, Stephane
dc.contributor.authorTeugels, Lieve
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorDecoster, Stefan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorSoethoudt, Job
dc.contributor.imecauthorDelabie, Annelies
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-29T06:09:25Z
dc.date.available2021-10-29T06:09:25Z
dc.date.embargo9999-12-31
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36146
dc.source.beginpage16
dc.source.conference23rd IEEE International Interconnect Technology Cconference - IITC 2020
dc.source.conferencedate5/10/2020
dc.source.conferencelocationSan Jose, CA (online) USA
dc.source.endpage18
dc.title

Hybrid Metallization with Cu in sub 30nm Interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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