Publication:

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

Date

2019
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorLiebens, Maarten
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorLi, Shifang
dc.contributor.authorBast, Gerard
dc.contributor.authorStoerring, Moritz
dc.contributor.authorHiebert, Stephen
dc.contributor.authorCross, Andrew
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorStoerring, Moritz
dc.contributor.imecauthorCross, Andrew
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T12:43:35Z
dc.date.available2021-10-27T12:43:35Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33448
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8572790
dc.source.beginpage54
dc.source.endpage61
dc.source.issue1
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.volume32
dc.title

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
39664.pdf
Size:
1.81 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles