Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
SmartSamples – Lowering integration risks for 3D TSV products
Publication:
SmartSamples – Lowering integration risks for 3D TSV products
Copy permalink
Date
2010-07
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Provoost, Jan
;
Van der Plas, Geert
;
Marchal, Pol
Journal
Future Fab International
Abstract
Description
Metrics
Views
1796
since deposited on 2021-10-18
Acq. date: 2025-12-16
Citations
Metrics
Views
1796
since deposited on 2021-10-18
Acq. date: 2025-12-16
Citations