Publication:
SmartSamples – Lowering integration risks for 3D TSV products
Date
| dc.contributor.author | Provoost, Jan | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Marchal, Pol | |
| dc.contributor.imecauthor | Provoost, Jan | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.date.accessioned | 2021-10-18T20:35:40Z | |
| dc.date.available | 2021-10-18T20:35:40Z | |
| dc.date.issued | 2010-07 | |
| dc.identifier.issn | 1363-5182 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17848 | |
| dc.identifier.url | http://www.future-fab.com/content/PDF/FF34_L_WP_Provoost_DIPI.pdf | |
| dc.source.beginpage | 47 | |
| dc.source.endpage | 51 | |
| dc.source.issue | 34 | |
| dc.source.journal | Future Fab International | |
| dc.title | SmartSamples – Lowering integration risks for 3D TSV products | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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