Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Thermo-mechanical modelling enhances optimisation of IC packages
Publication:
Thermo-mechanical modelling enhances optimisation of IC packages
Copy permalink
Date
2000
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marent, Katrien
;
Vandevelde, Bart
Journal
TAPtechnology
Abstract
Description
Metrics
Views
1901
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1901
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-15
Citations