Publication:

Thermo-mechanical modelling enhances optimisation of IC packages

Date

Loading...
Thumbnail Image

Journal

Abstract

Description

Metrics

Views

1901 since deposited on 2021-10-14
1last month
Acq. date: 2025-12-15

Citations

Metrics

Views

1901 since deposited on 2021-10-14
1last month
Acq. date: 2025-12-15

Citations