Publication:
Thermo-mechanical modelling enhances optimisation of IC packages
Date
| dc.contributor.author | Marent, Katrien | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Marent, Katrien | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-14T13:20:32Z | |
| dc.date.available | 2021-10-14T13:20:32Z | |
| dc.date.issued | 2000 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4565 | |
| dc.source.beginpage | 69 | |
| dc.source.endpage | 72 | |
| dc.source.issue | July | |
| dc.source.journal | TAPtechnology | |
| dc.title | Thermo-mechanical modelling enhances optimisation of IC packages | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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