Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages

Publication:

2023

Proceedings Paper

Author(s)

;

;

;

;

;

2023 IEEE 41st VLSI Test Symposium (VTS)

1 since deposited on 2023-07-24

Acq. date: 2026-01-09

1139 since deposited on 2023-07-24

2last month

1last week

Acq. date: 2026-01-09