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Wafer and simulations study comparing 5 LELE decomposition algorithms for both compliant and non-compliant lay-outs

Date

2009
Proceedings Paper
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dc.contributor.authorFenger, Germain
dc.contributor.authorLa Cour, Pat
dc.contributor.authorTritchkov, Alex
dc.contributor.authorKomirenko, Sergiy
dc.contributor.authorWiaux, Vincent
dc.contributor.imecauthorWiaux, Vincent
dc.date.accessioned2021-10-17T22:11:32Z
dc.date.available2021-10-17T22:11:32Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15299
dc.source.conference6th International Symposium on Immersion Lithography Extensions
dc.source.conferencedate22/10/2009
dc.source.conferencelocationPrague Czech Republic
dc.title

Wafer and simulations study comparing 5 LELE decomposition algorithms for both compliant and non-compliant lay-outs

dc.typeProceedings paper
dspace.entity.typePublication
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