Publication:

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712025

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Author(s)

Ain, Kaneeze Noorul

;

;

Rodrigues, Augusto

;

Hasan, Md Nazmul

;

Holzmann, Dominik

;

;

Chatterjee, Urmimala

;

Roshanghias, Ali

Journal

N/A

Statistics

243 since deposited on 2025-02-15

Acq. date: 2026-02-27