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An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Publication:
An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®
Date
2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712025
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ain, Kaneeze Noorul
;
Zhang, Guo Qi
;
Rodrigues, Augusto
;
Hasan, Md Nazmul
;
Holzmann, Dominik
;
Geens, Karen
;
Chatterjee, Urmimala
;
Roshanghias, Ali
Journal
N/A
Abstract
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Views
239
since deposited on 2025-02-15
Acq. date: 2025-10-24
Citations
Metrics
Views
239
since deposited on 2025-02-15
Acq. date: 2025-10-24
Citations