Publication:

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712025
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dc.contributor.authorAin, Kaneeze Noorul
dc.contributor.authorZhang, Guo Qi
dc.contributor.authorRodrigues, Augusto
dc.contributor.authorHasan, Md Nazmul
dc.contributor.authorHolzmann, Dominik
dc.contributor.authorGeens, Karen
dc.contributor.authorChatterjee, Urmimala
dc.contributor.authorRoshanghias, Ali
dc.contributor.imecauthorGeens, Karen
dc.contributor.imecauthorChatterjee, Urmimala
dc.contributor.orcidimecGeens, Karen::0000-0003-1815-3972
dc.contributor.orcidimecChatterjee, Urmimala::0000-0002-8934-6774
dc.date.accessioned2025-04-16T08:56:53Z
dc.date.available2025-02-15T21:13:58Z
dc.date.available2025-04-16T08:56:53Z
dc.date.issued2024
dc.description.wosFundingTextThis work has been conducted within All2GaN project. The ALL2GaN Project (Grant Agreement No 101111890) is supported by the Chips Joint Undertaking and its members including the top-up funding by Austria, Belgium, Czech Republic, Denmark, Germany, Greece, Netherlands, Norway, Slovakia, Spain, Sweden and Switzerland.
dc.identifier.doi10.1109/ESTC60143.2024.10712025
dc.identifier.eisbn979-8-3503-9036-0
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45211
dc.publisherIEEE
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
dc.source.numberofpages5
dc.title

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

dc.typeProceedings paper
dspace.entity.typePublication
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