Publication:

Fine-pitch 3D System Integration and Advanced CMOS nodes: Technology and System Design Perspective

Date

2021-02-22
Proceedings Paper
https://doi.org/10.1117/12.2584532
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dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorSisto, Giuliano
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidextSisto, Giuliano::0000-0001-8706-4311
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-07-12T07:28:51Z
dc.date.available2021-11-02T15:59:43Z
dc.date.available2022-07-04T07:07:04Z
dc.date.available2022-07-12T07:28:51Z
dc.date.embargo2021-12-04
dc.date.issued2021-02-22
dc.identifier.doi10.1117/12.2584532
dc.identifier.eisbn978-1-5106-4062-7
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37773
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.conferenceConference on Design-Process-Technology Co-optimization XV
dc.source.conferencedateFEB 22-26, 2021
dc.source.conferencelocationOnline
dc.source.journalProceedings of SPIE
dc.source.numberofpages6
dc.source.volume11614
dc.subject.disciplineElectrical & electronic engineering
dc.subject.keywords3D DTCO Partitioning
dc.title

Fine-pitch 3D System Integration and Advanced CMOS nodes: Technology and System Design Perspective

dc.typeProceedings paper
dspace.entity.typePublication
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