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Extreme silicon thinning for back side power delivery network: Si thinning stopping on scaled SiGe etch stop layer

 
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dc.contributor.authorSebaai, Farid
dc.contributor.authorLoo, Roger
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyne, Eric
dc.contributor.authorKawarazaki, Hikaru
dc.contributor.authorTeppei, Nakano
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.orcidimecSebaai, Farid::0009-0008-0186-6101
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecAltamirano Sanchez, Efrain::0000-0003-3235-6055
dc.date.accessioned2025-06-19T12:43:44Z
dc.date.available2024-08-07T19:37:37Z
dc.date.available2025-06-19T12:43:44Z
dc.date.issued2024
dc.description.wosFundingTextFarid Sebaai reports equipment, drugs, or supplies was provided by IMEC and Screen Semiconductor Solutions Co., Ltd. If there are other authors, they declare that they have no known competing financial in-terests or personal relationships that could have appeared to influence the work reported in this paper.
dc.identifier.doi10.1016/j.mee.2024.112246
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44274
dc.publisherELSEVIER
dc.source.beginpageArt. 112246
dc.source.endpageN/A
dc.source.issue15 November
dc.source.journalMICROELECTRONIC ENGINEERING
dc.source.numberofpages6
dc.source.volume294
dc.title

Extreme silicon thinning for back side power delivery network: Si thinning stopping on scaled SiGe etch stop layer

dc.typeJournal article
dspace.entity.typePublication
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