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Intra-field stress impact on global wafer deformation
Publication:
Intra-field stress impact on global wafer deformation
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Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van Haren, Richard
;
Otten, Ronald
;
Singh, Subodh
;
Singh, Amandev
;
Van Dijk, Leon
;
Owen, David
;
Anberg, Doug
;
Mileham, Jeffrey
;
Gu, Yajun
;
Hermans, Jan
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2243
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Acq. date: 2025-12-11
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Metrics
Views
2243
since deposited on 2021-10-27
1
last month
Acq. date: 2025-12-11
Citations