Publication:

Intra-field stress impact on global wafer deformation

Date

2019
Proceedings Paper
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dc.contributor.authorvan Haren, Richard
dc.contributor.authorOtten, Ronald
dc.contributor.authorSingh, Subodh
dc.contributor.authorSingh, Amandev
dc.contributor.authorVan Dijk, Leon
dc.contributor.authorOwen, David
dc.contributor.authorAnberg, Doug
dc.contributor.authorMileham, Jeffrey
dc.contributor.authorGu, Yajun
dc.contributor.authorHermans, Jan
dc.contributor.imecauthorvan Haren, Richard
dc.contributor.imecauthorHermans, Jan
dc.contributor.orcidimecHermans, Jan::0000-0003-1249-8902
dc.date.accessioned2021-10-27T20:55:37Z
dc.date.available2021-10-27T20:55:37Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34232
dc.identifier.urlhttps://doi.org/10.1117/12.2515391
dc.source.beginpage109591I
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXXIII
dc.source.conferencedate24/02/2019
dc.source.conferencelocationSan Jose, CA USA
dc.title

Intra-field stress impact on global wafer deformation

dc.typeProceedings paper
dspace.entity.typePublication
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