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Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C

Date

2018
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dc.contributor.authorChanson, Romain
dc.contributor.authorZhang, Liping
dc.contributor.authorNaumove, Sergei
dc.contributor.authorMankelevich, Yu.
dc.contributor.authorTillocher, Thomas
dc.contributor.authorLefaucheux, Phillipe
dc.contributor.authorDussart, Remi
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecde Marneffe, Jean-Francois::0000-0001-5178-6670
dc.date.accessioned2021-10-25T17:09:19Z
dc.date.available2021-10-25T17:09:19Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.issn2045-2322
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30391
dc.identifier.urlhttps://www.nature.com/articles/s41598-018-20099-5
dc.source.beginpage1886
dc.source.journalScientific Reports
dc.source.volume8
dc.title

Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C

dc.typeJournal article
dspace.entity.typePublication
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