Publication:
Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation
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1892 since deposited on 2021-10-17
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Acq. date: 2025-10-24
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Views
1892 since deposited on 2021-10-17
426item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations