Publication:
Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation
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1899 since deposited on 2021-10-17
1last month
Acq. date: 2026-03-18
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Statistics
Views
1899 since deposited on 2021-10-17
1last month
Acq. date: 2026-03-18
Citations