Publication:
Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation
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1898 since deposited on 2021-10-17
2last month
Acq. date: 2026-02-25
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Statistics
Views
1898 since deposited on 2021-10-17
2last month
Acq. date: 2026-02-25
Citations