Publication:
Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation
Date
| dc.contributor.author | Reiche, M. | |
| dc.contributor.author | Moutanabbir, O. | |
| dc.contributor.author | Himcinschi, C. | |
| dc.contributor.author | Christiansen, S. | |
| dc.contributor.author | Erfurth, E. | |
| dc.contributor.author | Goesele, U. | |
| dc.contributor.author | Mantl, S. | |
| dc.contributor.author | Buca, D. | |
| dc.contributor.author | Zhao, Q. T. | |
| dc.contributor.author | Loo, Roger | |
| dc.contributor.author | Nguyen, Duy | |
| dc.contributor.author | Muster, F. | |
| dc.contributor.author | Petzold, M. | |
| dc.contributor.imecauthor | Loo, Roger | |
| dc.contributor.orcidimec | Loo, Roger::0000-0003-3513-6058 | |
| dc.date.accessioned | 2021-10-17T10:07:22Z | |
| dc.date.available | 2021-10-17T10:07:22Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14364 | |
| dc.source.beginpage | 311 | |
| dc.source.conference | Semiconductor Wafer Bonding 10: Science, Technology, and Applications | |
| dc.source.conferencedate | 12/10/2008 | |
| dc.source.conferencelocation | Honolulu, HI USA | |
| dc.source.endpage | 320 | |
| dc.title | Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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