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A parylene temporary packaging technique for MEMS wafer handling
Publication:
A parylene temporary packaging technique for MEMS wafer handling
Date
2011
Journal article
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23617.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wen, Liangong
;
Wouters, K.
;
Ceyssens, F.
;
Witvrouw, Ann
;
Puers, Bob
Journal
Procedia Engineering
Abstract
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2
since deposited on 2021-10-19
Acq. date: 2025-10-24
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1888
since deposited on 2021-10-19
Acq. date: 2025-10-24
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Downloads
2
since deposited on 2021-10-19
Acq. date: 2025-10-24
Views
1888
since deposited on 2021-10-19
Acq. date: 2025-10-24
Citations