Publication:

A parylene temporary packaging technique for MEMS wafer handling

Date

2011
Journal article
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dc.contributor.authorWen, Liangong
dc.contributor.authorWouters, K.
dc.contributor.authorCeyssens, F.
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorPuers, Bob
dc.contributor.imecauthorPuers, Bob
dc.date.accessioned2021-10-19T21:48:08Z
dc.date.available2021-10-19T21:48:08Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.issn1877-7058
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20147
dc.source.beginpage1501
dc.source.endpage1504
dc.source.journalProcedia Engineering
dc.source.volume25
dc.title

A parylene temporary packaging technique for MEMS wafer handling

dc.typeJournal article
dspace.entity.typePublication
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