Publication:

Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma

Date

1999
Proceedings Paper
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dc.contributor.authorThompson, Heike
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorBeyer, Gerald
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVervoort, Iwan
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorStruyf, Herbert
dc.contributor.authorPalmans, Roger
dc.contributor.authorForester, Lynn
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-14T11:43:09Z
dc.date.available2021-10-14T11:43:09Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3880
dc.source.beginpage59
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
dc.source.conferencelocation
dc.source.endpage61
dc.title

Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma

dc.typeProceedings paper
dspace.entity.typePublication
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