Publication:

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Date

2014
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTanaka, Tetsu
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.date.accessioned2021-10-22T02:13:45Z
dc.date.available2021-10-22T02:13:45Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23985
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7152147
dc.source.beginpage1
dc.source.conferenceIEEE 3D System Integration Conference - 3DIC
dc.source.conferencedate1/12/2014
dc.source.conferencelocationKinsale Ireland
dc.source.endpage4
dc.title

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

dc.typeProceedings paper
dspace.entity.typePublication
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