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Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

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dc.contributor.authorChiappe, Daniele
dc.contributor.authorAfanasiev, Valeri
dc.contributor.authorTomczak, Yoann
dc.contributor.authorSutar, Surajit
dc.contributor.authorLeonhardt, Alessandra
dc.contributor.authorLudwig, Jonathan
dc.contributor.authorCelano, Umberto
dc.contributor.authorBrems, Steven
dc.contributor.authorDabral, Ashish
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorCaymax, Matty
dc.contributor.authorSchram, Tom
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorRadu, Iuliana
dc.contributor.imecauthorAfanasiev, Valeri
dc.contributor.imecauthorTomczak, Yoann
dc.contributor.imecauthorSutar, Surajit
dc.contributor.imecauthorLeonhardt, Alessandra
dc.contributor.imecauthorLudwig, Jonathan
dc.contributor.imecauthorCelano, Umberto
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorDabral, Ashish
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorCaymax, Matty
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.orcidimecCelano, Umberto::0000-0002-2856-3847
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.date.accessioned2021-10-25T17:13:31Z
dc.date.available2021-10-25T17:13:31Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30410
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2018-01/10/842.abstract
dc.source.beginpage842
dc.source.conferenceECS Spring Meeting Symposium on 2D Layered Materials from Fundamental Science to Applications
dc.source.conferencedate13/05/2018
dc.source.conferencelocationSeattle, WA USA
dc.title

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

dc.typeMeeting abstract
dspace.entity.typePublication
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