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Convolution-based fast thermal model for 3D-ICs: transient experimental validation
Publication:
Convolution-based fast thermal model for 3D-ICs: transient experimental validation
Date
2017
Journal article
https://doi.org/10.1109/TCPMT.2016.2638829
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maggioni, Federica
;
Cherman, Vladimir
;
Oprins, Herman
;
Beyne, Eric
;
De Wolf, Ingrid
;
Baelmans, Martine
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
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1949
since deposited on 2021-10-24
Acq. date: 2025-10-25
Citations
Metrics
Views
1949
since deposited on 2021-10-24
Acq. date: 2025-10-25
Citations