Convolution-based fast thermal model for 3D-ICs: transient experimental validation

dc.contributor.author	Maggioni, Federica
dc.contributor.author	Cherman, Vladimir
dc.contributor.author	Oprins, Herman
dc.contributor.author	Beyne, Eric
dc.contributor.author	De Wolf, Ingrid
dc.contributor.author	Baelmans, Martine
dc.contributor.imecauthor	Cherman, Vladimir
dc.contributor.imecauthor	Oprins, Herman
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.orcidimec	Oprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned	2021-10-24T08:28:10Z
dc.date.available	2021-10-24T08:28:10Z
dc.date.issued	2017
dc.identifier.doi	10.1109/TCPMT.2016.2638829
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/28883
dc.identifier.url	http://ieeexplore.ieee.org/document/7820154/
dc.source.beginpage	221
dc.source.endpage	228
dc.source.issue	2
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	7
dc.title	Convolution-based fast thermal model for 3D-ICs: transient experimental validation
dc.type	Journal article
dspace.entity.type	Publication
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