Publication:

Direct bonding of low temperature heterogeneous dielectrics

Date

2019
Proceedings Paper
https://doi.org/10.1109/ECTC.2019.00-16
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

Published version 736.51 KB

Author(s)

Iacovo, Serena  
;
Peng, Lan  
;
Phommahaxay, Alain  
;
Inoue, Fumihiro  
;
Verdonck, Patrick  
;
Kim, Soon-Wook  
;
Sleeckx, Erik  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Abstract

Description

Statistics

Downloads

2 since deposited on 2022-04-01
Acq. date: 2026-04-06

Views

1839 since deposited on 2022-04-01
1last month
1last week
Acq. date: 2026-04-06

Citations

Statistics

Downloads

2 since deposited on 2022-04-01
Acq. date: 2026-04-06

Views

1839 since deposited on 2022-04-01
1last month
1last week
Acq. date: 2026-04-06

Citations