Publication:

Direct bonding of low temperature heterogeneous dielectrics

Date

2019
Proceedings Paper
https://doi.org/10.1109/ECTC.2019.00-16
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Author(s)

Iacovo, Serena  
;
Peng, Lan  
;
Phommahaxay, Alain  
;
Inoue, Fumihiro  
;
Verdonck, Patrick  
;
Kim, Soon-Wook  
;
Sleeckx, Erik  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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1835 since deposited on 2022-04-01
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2 since deposited on 2022-04-01
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1835 since deposited on 2022-04-01
Acq. date: 2025-12-16

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