Publication:

Direct bonding of low temperature heterogeneous dielectrics

Date

2019
Proceedings Paper
https://doi.org/10.1109/ECTC.2019.00-16
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dc.contributor.authorIacovo, Serena
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecInoue, Fumihiro::0000-0003-2292-846X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2022-04-04T09:22:07Z
dc.date.available2022-04-01T15:23:06Z
dc.date.available2022-04-04T09:22:07Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.doi10.1109/ECTC.2019.00-16
dc.identifier.eisbn978-1-7281-1498-9
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39563
dc.publisherIEEE
dc.source.beginpage2206
dc.source.conference69th IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 29-31, 2019
dc.source.conferencelocationLas Vegas
dc.source.endpage2212
dc.source.journal2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.numberofpages7
dc.subject.keywordsTHERMAL SILICON
dc.subject.keywordsWAFER
dc.subject.keywordsMECHANISM
dc.title

Direct bonding of low temperature heterogeneous dielectrics

dc.typeProceedings paper
dspace.entity.typePublication
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