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Advanced physical analysis of 3D interconnect
Publication:
Advanced physical analysis of 3D interconnect
Date
2012
Presentation
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25361.pdf
41.98 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ramachandran, Vidhya
;
Torregiani, Cristina
;
Dong Wook, Kim
;
Gu, Sam
;
Nowak, Matt
;
DiBattista, Michael
;
Babak, Motamedi
;
Civale, Yann
;
Redolfi, Augusto
;
Beyne, Eric
;
Croes, Kristof
;
Li, Yunlong
;
Routh, Bryan
;
Rue, Chad
Journal
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2050
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations
Metrics
Views
2050
since deposited on 2021-10-20
Acq. date: 2025-10-23
Citations