Publication:

Advanced physical analysis of 3D interconnect

Date

2012
Presentation
Simple item page Full metadata Statistics
 
dc.contributor.authorRamachandran, Vidhya
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorDong Wook, Kim
dc.contributor.authorGu, Sam
dc.contributor.authorNowak, Matt
dc.contributor.authorDiBattista, Michael
dc.contributor.authorBabak, Motamedi
dc.contributor.authorCivale, Yann
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.contributor.authorLi, Yunlong
dc.contributor.authorRouth, Bryan
dc.contributor.authorRue, Chad
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.accessioned2021-10-20T15:05:28Z
dc.date.available2021-10-20T15:05:28Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21374
dc.source.conference29th Annual Advanced Metallization Conference - AMC
dc.source.conferencedate9/10/2012
dc.source.conferencelocationAlbany, NY USA
dc.title

Advanced physical analysis of 3D interconnect

dc.typeOral presentation
dspace.entity.typePublication
Files

Original bundle

Name:
25361.pdf
Size:
41.98 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Presentations