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NiO resistive switching material integrated at the bottom of via holes from localized oxidation of nickel metallic layer
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NiO resistive switching material integrated at the bottom of via holes from localized oxidation of nickel metallic layer
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Date
2009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Courtade, Lorene
;
Muller, Ch.
;
Turquat, Ch.
;
Lisoni, Judit
;
Goux, Ludovic
;
Deleruyelle, D.
;
Wouters, Dirk
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1977
since deposited on 2021-10-17
Acq. date: 2025-12-09
Citations
Metrics
Views
1977
since deposited on 2021-10-17
Acq. date: 2025-12-09
Citations