Publication:

NiO resistive switching material integrated at the bottom of via holes from localized oxidation of nickel metallic layer

Date

2009
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dc.contributor.authorCourtade, Lorene
dc.contributor.authorMuller, Ch.
dc.contributor.authorTurquat, Ch.
dc.contributor.authorLisoni, Judit
dc.contributor.authorGoux, Ludovic
dc.contributor.authorDeleruyelle, D.
dc.contributor.authorWouters, Dirk
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.date.accessioned2021-10-17T21:40:36Z
dc.date.available2021-10-17T21:40:36Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15132
dc.source.conference18th Workshop Materials for Advanced Metallization - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
dc.title

NiO resistive switching material integrated at the bottom of via holes from localized oxidation of nickel metallic layer

dc.typeOral presentation
dspace.entity.typePublication
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