Publication:

Minimizing plasma damage of CVD low-k materials by tuning a two step etch sequence.

Date

 
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-15T16:46:40Z
dc.date.available2021-10-15T16:46:40Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9702
dc.source.conferenceInternational Symposium on Dry Process - DPS
dc.source.conferencedate30/11/2004
dc.source.conferencelocationTokyo Japan
dc.title

Minimizing plasma damage of CVD low-k materials by tuning a two step etch sequence.

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections: