Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography

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Author(s)

Mankala Ramakrishna Sharma, Anjanashree

;

Jacobs, Kristof J. P.

;

;

De Wolf, Ingrid

Journal

JOURNAL OF FAILURE ANALYSIS AND PREVENTION

Metrics

260 since deposited on 2024-08-16

Acq. date: 2025-10-27