Publication:

Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography

Date

2024
Journal article
https://doi.org/10.1007/s11668-024-02000-x
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dc.contributor.authorMankala Ramakrishna Sharma, Anjanashree
dc.contributor.authorJacobs, Kristof J. P.
dc.contributor.authorCoenen, David
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorJacobs, Kristof J. P.
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorMankala Ramakrishna Sharma, Anjanashree
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecMankala Ramakrishna Sharma, Anjanashree::0000-0001-5617-5940
dc.date.accessioned2025-05-05T11:42:21Z
dc.date.available2024-08-16T18:28:05Z
dc.date.available2025-05-05T11:42:21Z
dc.date.issued2024
dc.description.wosFundingTextThe authors would like to thank Dr. Nicolas Pantano, 3D system integration and GaN research teams at IMEC for providing the test samples.
dc.identifier.doi10.1007/s11668-024-02000-x
dc.identifier.issn1547-7029
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44315
dc.publisherSPRINGERNATURE
dc.source.beginpage2129
dc.source.endpage2141
dc.source.issue5
dc.source.journalJOURNAL OF FAILURE ANALYSIS AND PREVENTION
dc.source.numberofpages13
dc.source.volume24
dc.title

Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography

dc.typeJournal article
dspace.entity.typePublication
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