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Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below
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Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below
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Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Van Huylenbroeck, Stefaan
;
Roussel, Philippe
;
Brouri, Mohand
;
Gopinath, Sanjay
;
Anjos, Daniela M.
;
Thorum, Matthew
;
Yu, Jengyi
;
Beyer, Gerald
;
Beyne, Eric
;
Croes, Kristof
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1922
since deposited on 2021-10-22
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Acq. date: 2025-12-09
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Metrics
Views
1922
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-09
Citations